08 May 2012
The Editors of the IEEE Transactions on Components, Packaging and Manufacturing Technology have selected a CTVR paper as the 2011 Best Paper in the Components: Characterization and Modeling category in the journal IEEE Transactions on Components, Packaging and Manufacturing Technology.
The award will be presented at the 62nd Electronic Components and Technology Conference (ECTC, 29 May – 1 June 2012, San Diego, California, USA) on Thursday, 31 May.
The paper is
“Phenomenological Study of the Effect of Microstructural Evolution on the Thermal Fatigue Resistance of Pb-Free Solder Joints” by J Richard Coyle, John Osenbach, Maurice N. Collins, Heather McCormick, Peter Read, Debra Fleming, Richard Popowich, Jeff Punch, Michael Reid, and Steven Kummerl, VOL.1, NO. 10, October 2011
